Beyond Problems, to Solutions. RKD Systems Omega Prep We don’t break die The OmegaPrep was designed to perform in package die thinning and polishing in addition to a number of machining functions for sample preparation. The die thinned and polished by the...
Beyond Problems, to Solutions. RKD Systems Ultra Prep III We don’t break die LARGE DIE BACKSIDE THINNING WITH MINIMAL THICKNESS VARIATION UltraPrep III is designed to perform in-package die thinning and polishing, along with special machining functions for...
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