RKD Systems Omega Prep
We don’t break die
The OmegaPrep was designed to perform in package die thinning and polishing in addition to a number of machining functions for sample preparation. The die thinned and polished by the OmegaPrep are compatible with all backside procedures such as IR emission microscopy and FIB edit. OmegaPrep can also perform mechanical decapsulation, removal of heat spreaders and heat sinks, and can easily remove plastic packaging and die attach pad to expose the die. Additional capabilities have been included that provide processes for die de-layering &/or de-processing; substrate or PCB delayering; fixture machining; selected area thinning to 1µm remaining silicon, and more.
OmegaPrep is a specially designed, CNC machining system controlled by a graphic user interface that allows for the operator to select the desired functions and enter the key device measurements and process parameters. There is no need to know anything about machining or “G Code” to operate the OmegaPrep. There are no knobs to adjust, or cranks to turn. ‘Speeds and Feeds’ are preset for each process to optimize processing results.
Automatic tool touch-down detection, video alignment and special profiling functions make set-device set up simple and easy. The surface profiling function eliminates the need for die leveling and maintains a constant resulting thickness for both die thinning and consistent layer removal during delayering processes.
Die as large as 44mm (square) and delayering and machining areas up to 55mm square can be accommodated. Packages up to 150mm long x 125mm wide can be mounted on the standard fixtures supplied with the system. Custom fixtures can be supplied for even larger devices.
- Die thinning and polishing
- Local area thinning to 1µm remaining silicon
- Optional silicon measurement systems for best thickness control
- Encapsulant and die attach removal
- Heat sink removal
- Substrate and PCB delayering
- Substrate removal
- Stacked die removal
- C4 ball exposure
- Die de-layering or de-processing
- Automatic leveling and surface profile measurement
- Optional, in situ, silicon thickness measurement
- Simple sample mounting and alignment
- Process recipes can be saved for later use
At the beginning of each process, the OmegaPrep will measure the surface profile of the sample. This is done by contacting the surface at discrete points and recording the surface height at each measured point. The touch tool used has a spherical tip to eliminate surface damage from such contacts. The measured profile points are used to generate a ‘wire frame model’ representation of the surface that is subsequently used to generate the three dimensional path of the tool tip during process. The measurement of the surface profile completely eliminates the need for any sample leveling adjustments. The number of measured points and their positions are selected by the OmegaPrep on the basis of the sample size and the process to be run. For very small samples, only four points are measured. The four points are used to define the average plane of the surface and is all that is required as the variation in surface profile from a plane is limited by the mechanical properties of the sample.
Between the process steps during die thinning, the sample holder and sample are removed for cleaning. Often, due to possible particulates trapped between the sample holder and the stage, the sample profile may be rotated slightly from the initial profile measurements. This is corrected for by measuring a small number of points on the surface and mathematically rotating the stored profile to match. Some processes allow for the operator to input silicon thickness measurements. The optional thickness measurement systems can be used to measure the remaining silicon thickness. The thickness profile, either entered by the operator, or measured by the OmegaPrep, will be used to correct the mechanical surface profile to maintain a constant silicon thickness over the area being processed.
Once the device and process parameters, die size, die position, die attach pad size, amount of removal, etc., have been programmed, they can be saved as a process recipe. The recipe can be recalled for reference, or duplication of the processing for a different sample. Up to 96 recipes can be stored in the OmegaPrep, each with a unique, operator generated name.
During the processing of a sample, all parameters and operator actions can be saved for future printing or review. This leaves a complete history of each sample processed.
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