Our products serve Semiconductor, including Failure Analysis, Reliability, QA/QC; Nanotechnology; Materials Sciences; MEMS; Polymer Chemistry; Bio-Medical Engineering; Biophysics.

Our advanced technology products include:

• Die thinning and polishing that uses predictive look-ahead software to correct for die warp and contour anomalies in single and multi-dice packaging – ULTRAPREP
• High Precision, high speed milling system to remove IC packages from either a PC board or a chip onFlex while keeping the ball bonds intact.  High precision die thinning and polishing down to less than a micron. The ability to measure remaining silicon thickness to 0.5 microns and does everything that the UltraPrep does only faster and with higher precision – OMEGAPREP
• TM series tabletop SEM, from Hitachi High-Technology – TM-4000, TM-4000Plus
• The Tabletop SEM that combines high resolution resolution with precise control of vacuum pressure for unmatched results and ease of use – FlexSEM 1000
• Turn your TM or FlexSEM into a STEM using the UVD-STEM holder – TM STEM Solution
• EDS Analysis: AZTEC from Oxford Instruments – EDS Analysis
• EDS Analysis:  Quantax from Bruker Instruments– EDS Analysis